Gold Reviewer, ICML 2026
Bilsland Dissertation Fellowship, College of Engineering, Purdue University
Qualcomm Innovation Fellowship Abstract Selection (Context-Aware Multi-Agent Sensing for Human Activity Monitoring), Qualcomm
Apple AI/ML Fellowship Nominee, Purdue University
Student Travel Award, ACM SenSys 2024
Student Travel Award, ACM KDD 2024
Travel Grant, Purdue Graduate Student Government (PGSG), Purdue University
Dean’s Honors List 2019/20, Faculty of Engineering, The Hong Kong Polytechnic University
Best Student Paper Award, ACM BSCI 2019
Scholarship Fund – Reaching Out Award 2018/19, Hong Kong Special Administrative Region Government
Wong Tit-shing Student Exchange Scholarship, The Hong Kong Polytechnic University
First Runner Up (on spot), 2017 ACM-ICPC Taiwan Summer Training Camp Invitational Contest